Education
Jan. 2005 – Jan. 2011
Beihang University, Beijing, China
Ph. D., Major: Precision Instrument & Machinery
Dissertation: Research on Online 3-D Profile Measurement for Large-scale Structure Piece
Work Experience
Jan. 2011 - now
School of Instrumentation Science & Opto-electronics Engineering,
Beihang University, Beijing, China
37 Xueyuan Road, Haidian District, Beijing, China
Associate professor
Research on optical 3-D profile measurement techniques
Jiang Hongzhi, Ph.D., is currently an Associate Professor and Doctoral Supervisor at Beihang University. He conducts innovative fundamental theory and key technology research in areas including single-pixel imaging and its applications, vision measurement, photoelectric precision measurement, close-range industrial photogrammetry, and optical 3D imaging.
His key research directions encompass parallel single-pixel imaging theory, vision imaging simulation methods based on ray tracing, measurement and modeling of camera point spread functions based on single-pixel imaging, precision measurement techniques for highly reflective surfaces, vision system calibration technology, and intelligent analysis of 3D data.
He has developed a parallel single-pixel imaging system, a large-scale spatial structure flatness measurement system, an in-situ 3D vision measurement system for aerospace structural components, a 3D measurement system for honeycomb core envelope surfaces, a measurement and machining allowance analysis system for blank parts like large cast/forged parts and 3D printed components, a robotic automatic 3D vision inspection system, and a vision coordinate measuring system, which find extensive applications in aerospace, intelligent manufacturing, 3C electronics, transportation, healthcare, artwork, and cultural relic preservation.
This achievement earned him the Second Prize of the National Technology Invention Award in 2013. He has presided over national projects such as the National Natural Science Foundation of China General Program, sub-projects of the National Key R&D Program, and technical fundamental research projects, as well as industry collaboration projects.
