Short Biography
Haifeng Dong received his Ph.D. in Microelectronics and Solid-State Electronics from Peking University in 2005. He subsequently conducted postdoctoral research at the Massachusetts Institute of Technology (MIT), focusing on micro gas turbine technologies. He later spent one year as a visiting scholar in the Department of Physics at Princeton University, working under the supervision of Professor Michael Romalis on short-pulse optical pumping and SERF magnetometer research. He is currently an Associate Professor in the School of Instrumentation Science and Opto-Electronics Engineering at Beihang University. His research interests include quantum sensing, microfabrication, microelectromechanical systems (MEMS) etc..
Research Area
Atomic Magnetometer and Magnetic gradiometer
Atomic Magnetic Field Microscopy
Microfabrication of quantum sensors
Courses
MEMS
Advanced Microfabrication on Sensors & Acutators
Papers & Books
1. Hangfei Ye, Chenlu Xu, Min Hu, Haifeng Dong*, A compact unshielded optically pumped magnetic gradiometer, Review of Scientific Instruments, 96, p.055004, 2025
2. Haifeng Dong, Hangfei Ye, Min Hu and Zongmin Ma, Recent Developments in Fabrication Methods and Measurement Schemes for Optically Pumped Magnetic Gradiometers: A Comprehensive Review. Micromachines, 15 (59)， 2024
3. Hu, M., Jiang, W., Ye, H., Dong, H.*, & Liu, Y. Small scale magnetic field source detection using recessed atomic vapor cell. Journal of Applied Physics, 133(16), 2023
4. Chen Liu, Haifeng Dong*, and Junjun Sang，Submillimeter-resolution magnetic field imaging with digital micromirror device and atomic vapor cell, Applied Physics Letters, vol. 119, p. 114002, 2021.
5. Meng Shi and Haifeng Dong*, “Theoretical study of the close-loop atomic magnetometer with a transverse pumping feedback”, Measurement Science and Technology, vol.32, p.125119, 2021.
6. Hai-Feng Dong, Jing-Ling Chen, Ji-Min Li, Chen Liu, Ai-Xian Li, Nan Zhao, and Fen-Zhuo Guo, “Spin image of an atomic vapor cell with a resolution smaller than the diffusion crosstalk free distance”, Journal of Applied Physics, vol. 125, pp. 243904, 2019.
7. H.-F. Dong, L.-X. Yin, A.-X. Li et al., “Observation and analysis of the spatial frequency response of an atomic magnetometer”, Journal of Applied Physics, vol. 125, no. 2, pp. 023908, 2019.
8. H. Dong, X. Wang, J. Li et al., “An Atomic Magnetometer with Spin-Projection-Noise Proportional to T2^1/2”, Chinese Physics Letters, vol. 36, no. 2, pp. 020701, 2019.
9. H. Dong, Y. Gao, “Comparison of compensation mechanism between an NMR gyroscope and an SERF gyroscope”, IEEE Sensors Journal, Vol. 17, No. 13 pp.4052-4055, 2017
10. Y. Gao, H. Dong*，et.al. “Combined effect of light intensity and temperature on the magnetic resonance linewidth in alkali vapor cell with buffer gas”, Chin. Phys. B Vol. 26, No. 6, p. 077801, 2017
11. H. Huang, H. Dong*, L. Chen, and Y. Gao, "Single-beam three-axis atomic magnetometer", Applied Physics Letters, vol. 109, p. 062404, 2016.
12. H. Huang, H. Dong*, X. Hu, L. Chen, and Y. Gao, "Three-axis atomic magnetometer based on spin precession modulation," Applied Physics Letters, vol. 107, p. 182403, 2015.
13. H. Huang, H. Dong*, H. Hao, and X. Hu, "Close-Loop Bell--Bloom Magnetometer with Amplitude Modulation," Chinese Physics Letters, vol. 32, p. 098503, 2015.
14. C. Zhuo, H. Dong*, and L. Xuan, "Three Dimensional Compensation Spherical Coils for Compact Atomic Magnetometer," Journal of Applied Science and Engineering, vol. 17, pp. 215-222, 2014.
15. H. Dong, H. Lin, and X. Tang, "Atomic-signal-based zero field finding technique for unshielded laser-pumped atomic magnetometer," IEEE Sensors Journal, vol. 13, pp. 186-189, 2013.
16. H. Dong, J. Fang, B. Zhou, X. Tang, and J. Qin, "Three dimensional atomic magnetometry," European Physical Journal AP, vol. 57, p. 21004, 2012.
17. H. Dong, J. Fang, and J. Qin, "Analysis of the Electrons-Nuclei Coupled Atomic Gyroscope," Optics Communications, vol. 284, pp. 2886-2889, 2011
18. H. Dong, J. Fang, B. Zhou, J. Qin, and S. Wan, "Review of atomic MEMS: driving technologies and challenges," Microsystem Technologies, vol. 16, pp. 1683-1689, 2010.
19. H. Dong, "Single-wafer die-level fusion bonding process for multi-layer devices," Microsystem Technologies, vol. 15, pp. 981-984, 2009.
